The primary focus of this role will be to develop package process engineering for use on future development and prototyping efforts for DoD customers. You will support a variety of efforts with a focus on defining mechanical outline and construction details, connector selection and specification, mechanical and assembly drawings, oversee electrical layout and be responsible for final technical data package. The typical products developed will be prototypes or low-rate production efforts. This position does require a Bachelor’s Degree in Materials, Mechanical, or Electrical Engineering and six + years of experience in the design and test of electronics packaging for military, industry, or aerospace applications. Must be eligible to obtain and maintain a Top Secret Clearance.